内容标题38

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                  Laser Direct Imaging

                  TZTEK TZDI series laser direct imaging device uses submicron linear module, fully-enclosed optical design and all new generation DMD control technique to provide highly resolved, highly productive and highly accurate features as compared with traditional PCB touch imaging. It is applicable to image transfer of double-sided board, multi-layer board and HDI board in the rigid board field, as well as FPC and IC carrier boards.

                  SPECIFICATION PARAMETER

                  Specifications

                  TZDI-35 TZDI-20F TZDI-20R TZDI-15 TZDI-12 TZUVDI-20
                  Applied Procedure Pattern Procedure Pattern Procedure Pattern Procedure Pattern Procedure Pattern Procedure Pattern/Soldermask  Procedure
                  Throughput(side/h) 300 450 300 300 225 300
                  650
                  Max Dimension(mm) 630×810 550×810 630×810 550×810 520×810 594×810
                  Min Dimension(mm) 125×125 125×125 125×125 125×125 125×125 125×125
                  Panel Thickness Spec(mm) 0.025-5 0.025-5 0.025-5 0.025-5 0.025-5 0.025-5
                  Min Resolution(μm) 35/35 20/20 20/20 15/15 12/12 20/20
                  Recommended Resolution(μm)* 55/55 35/35 35/35 25/25 18/18 35/35
                  Registration Accuracy(μm) ±12 ±8 ±8 ±6 ±5 ±8
                  Top-to-Bottom Registration Accuracy(μm) 24 16 16 12 10 16
                  Wave Length(nm) 405 405 405 405 405 365+385+405
                  Illumination Uniformity 95% 95% 95% 95% 95% 95%

                  * The suggested L/S is related to The dry film and process conditions,subject to the practice

                  ** Environment temperature 22±2℃

                  *** Environment humidity 55±5%

                  **** Clean class 10000

                  ***** Optional Automatic line for all LDI type