内容标题6

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                  Equipment Model TZDI-6 TZDI-12 TZDI-20 TZDI-25 TZDI-35
                  Substrate Size 630×660 mm 630×810 mm 550×810 mm 530×850 mm 630×810 mm
                  Substrate Thickness 0.025-5.0 mm 0.02-5.0 mm 0.05-5.0 mm 0.05-5.0 mm 0.05-5.0 mm
                  Limit 6 μm 12 μm 20 μm 25 μm 35 μm
                  MP Analysis 12 μm 20 μm 35 μm 40 μm 50 μm
                  Linewidth Accuracy ±10% ±10% ±10% ±10% ±10%
                  Alignment Accuracy ±6μm ±8μm ±8μm ±12μm ±12μm
                  Inter Layer Alignment Accuracy 10 μm 16 μm 24 μm 24 μm 24 μm
                  Maximum Capacity 20mj / s @30 20mj / s @14 20mj / s @8 20mj / s @8 20mj / s @8.5
                  Recommended Application IC substrate IC substrate,SLP HDI,MLB和FPC PCB, FPC MLB (inner and outer layer) ceramic substrate
                  Equipment Model TZUVDI-20 TZUVDI-35
                  Substrate Size 600×660 mm 609×810 mm
                  (550×610 mm, 630×810 mm)
                  Substrate Thickness 0.05-5.0 mm 0.05-5.0 mm
                  Minimum Window 50 μm 100 μm
                  Minimum resistance welding Bridge 50 μm 75 μm
                  Linewidth Accuracy ±10% ±10%
                  Alignment Accuracy ±12μm ±12μm
                  Inter layer alignment accuracy 24 μm 24 μm
                  Maximum Capacity 50seconds / face @ 300MJ 12 seconds / face @ 300MJ
                  Recommended Application Soft board and hard board anti welding, inner and outer circuit Soft board and hard board anti welding, inner and outer circuit
                  Other / 415nm light source is selected for white oil application
                  Training certificate query