内容标题9

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                  Optical metrology is a non-contact, non-destructive measurement technique-. It is precise and it is fast. A structure's width is extracted from its intensity profile in the CCD camera image. The pictures on the right illustrate the principle. The violet rectangle called Region Of Interest (ROI) defines the part of the structure that needs to be measured. In this case the measured width is an averaged width along the line within the ROI. The intensity profile has to be processed extensively to clean it from disturbing effects like statistical photon noise or deformations by optical diffraction effects. This, of course, is done automatically by the MueTec Tools.


                  HOW IT WORKS

                  From the image, the intensity profile across the line is calculated and averaged along the line. The resultant intensity profile is second image on the right. Please note that the edges of the profile left and right are not vertical but smeared out resulting in sloping edge profiles. This may be due to optical effects or imperfections in the line shape itself.

                  The feature size (or critical dimension) is the distance between the left and the right edge.

                  The CD value with best possible accuracy is calculated from this intensity profile with sub-pixel resolution. The threshold is defined typically between 40% to 60%. of the lowest and the highest intensity found in the intensity profile. The edge position is taken at the intersection of the profile with the threshold, and the resultant (CD) value for the feature size is the distance between both intersections.

                  For structures in the sub micrometer range below ~0.7&micro;m the MueTec system may use UV illumination (365 nm). In this case the tool is equipped with a special objective lens, a light path and an integrated CCD camera that perform with both white and UV light.



                  EASY TO USE

                  Especially in the field of microelectronics some very special, sophisticated options have been developed to measure structures with a particular layout e.g. very closely arranged lines and spaces, dots and holes on masks, and other memory specific structures.

                  Although the automated hardware and software package to perform CD metrology is very complex with e.g. the MT3000 it becomes an easy-to-use application. The high precision and performance MueTec achieves in CD metrology is a result of the combination of the highest quality optics, the best laser autofocus system together with our software know-how.The  long-standing experience in this complex field, and the capability to combine high precision with individual, customized solutions for all metrology applications, has ensured MueTec a leading position among metrology tool manufacturers.

                  PRODUCTS
                  • DaVinci 200IR + 300IR
                    200mm MEMS inspection and metrology system (SMIF)
                    DaVinci 200IR + 300IR

                    Typical Applications

                    Sealing Inspection after bonding (eutectic bonding or glass frit bonding)

                    Device Inspection after bonding

                    Overlay Metrology after bonding

                    Critical Dimension Metrology after bonding


                    Features

                    Best inclassIR image quality with wafelengths of up to 1500nm

                    Flexible handling (backside vacuum, flipping, edge-vacuum) for MEMS specific wafers

                    Combined reflected & transmitted light illumination modes

                    SECS/GEM


                  • MT3000
                    Fully automated metrology and inspection system (open cassette)
                    MT3000

                    Typical Applications

                    CD

                    Overlay

                    Film Thickness

                    Defect Inspection

                    Defect Review


                    Features

                    VIS, UV

                    Simultaneous wafer handling 75 - 200mm

                    SECS/GEM

                  • MT270UV
                    Fully automated metrology and inspection system (open cassette)
                    MT270UV

                    Typical Applications

                    CD

                    Overlay

                    Film Thickness

                    Defect Inspection

                    Defect Review


                    Features

                    VIS, UV

                    Simultaneous wafer handling 75 - 200mm

                    SECS/GEM